After-sales services, rework and revamping

Rework, repairs, failure analysis, return management, revamping, ESD packaging and custom packaging for redelivery or service continuity.

SCEN supports customers even after production, managing field returns, analysis, rework, repairs, upgrades and revamping. Internal expertise makes it possible to work on complex electronic products, extend their life cycle and return them with ESD packaging or custom packaging.

SCEN can support customers in managing products returned from the field, organizing preliminary analysis, product condition verification, identification of the required intervention and subsequent processing. This service helps ensure continuity for products already installed or delivered, reducing waste, downtime and operational complexity for the customer.

When a product shows anomalies or non-conformities, SCEN can perform failure analysis activities to identify the possible origin of the problem. The skills developed in quality control, 3D X-ray analysis, electrical testing and microelectronic processing allow SCEN to evaluate complex boards and devices, distinguishing assembly defects, operational stress, process criticalities or possible areas for design improvement.

Analytical expertise, equipment quality and operator experience allow SCEN to intervene on finished products requiring repairs, modifications or specialized processing. Thanks to control of the entire production cycle, SCEN can precisely identify the required intervention and work even on complex electronic and mechatronic components, including miniaturized packages such as uBGA, PoP, and Top and Bottom processing.

Revamping makes it possible to update, refurbish or modify existing products to extend their useful life, improve performance or adapt them to new technical requirements. SCEN can support customers in evaluating the intervention, replacing components, updating electronic or mechanical parts and returning the product to service, when technically sustainable.

After analysis, rework, repair or revamping activities, SCEN can manage product redelivery with ESD packaging and custom packaging. This phase protects boards, modules and devices during handling, storage and transport, ensuring that the product re-enters the customer’s operational flow with adequate protection and traceability.

In brief

  • Management of products returned from the field
  • Failure analysis on boards, modules and electronic products
  • Rework and repairs on PCBs and PCBAs
  • Interventions on complex and miniaturized components
  • Processing on uBGA, PoP, Top and Bottom
  • Revamping, upgrades and refurbishment
  • Support for product service continuity
  • ESD packaging and custom packaging for redelivery
  • Possible involvement of qualified external laboratories and partners

Equipment and technologies

  • 1 PCB and PCBA micro-laser repair line
  • 2 air and vapor reworking stations
  • Nanofocus 3D X-ray analysis supporting diagnosis
  • Optical inspection and process inspections
  • Electrical tests and functional checks
  • X-ray fluorescence for material or surface analysis
  • Micro-laser for surface treatment, track cutting and depaneling
  • Application of IPC standards to processing activities

Do you have products to analyze, repair or upgrade?

SCEN can manage returns, rework and revamping to extend their life cycle.

Request support