Hi-tech electronic board assembly with microcomponents

SMT/THT lines, microcomponents from 01005 package size to BGA/uBGA fine pitch 0.2 mm, prototypes, series production and complete board industrialization.

PCB assembly has always been the productive core of SCEN. The Smart Factory integrates SMT and THT lines to manufacture complex PCBAs, prototypes, small series and industrialized productions, combining miniaturization, assembly precision, connection robustness and process control.

SMT, Surface Mount Technology, allows components to be assembled directly onto the PCB surface, without through-holes, enabling compact layouts and high assembly density. At SCEN, it is used for advanced microelectronic boards, complex prototypes and series production requiring precision, repeatability and cost optimization. The process integrates solder paste printing, automatic component placement, controlled reflow and depaneling, making it possible to handle miniaturized components, advanced packages and highly complex configurations.

In brief

  • 5 SMT assembly lines, 3 of which are fully automated
  • Production capacity up to 250,000 components/hour
  • Components from 01005 package size to 2512 package size
  • BGA and uBGA packages, also with 0.2 mm fine pitch
  • PoP, Package on Package, technique for stacked BGAs
  • PiP, Pin in Paste, technique for combining SMT and THT/PTH
  • Management of prototypes, small series and scalable production

Equipment and technologies

  • 3 DEK screen-printing machines for customized stencils
  • Photo-etched, hydro-laser, electroformed and 2D stencils
  • 5 Europlacer pick & place machines
  • 3 Heller air reflow ovens
  • 1 IBL vapor phase oven
  • 1 Asscon vacuum vapor phase oven
  • 1 dual-head CNC depaneling machine
  • 1 laser depaneling machine

Within the SCEN cycle, THT, Through-Hole Technology, is used when mechanical robustness and connection reliability are central project requirements. Components are inserted into the through-holes of the PCB and soldered through dedicated processes, such as wave soldering and selective soldering. Wave soldering enables multiple components to be fixed uniformly, while selective soldering allows precise intervention on specific areas, protecting parts already assembled. This makes THT ideal for components subject to vibrations, mechanical stress or demanding operating conditions.

In brief

  • 1 THT preforming and assembly line
  • Through-hole component insertion
  • Wave soldering for multiple components
  • Selective soldering for mixed SMT/THT PCBs
  • Greater robustness for connections subject to mechanical stress

Equipment and technologies

  • Ersa Wave soldering machine
  • Ecoselect selective soldering machine

SCEN does not simply assemble the board: it supports the transition from prototype to industrialized production. The team assesses bill of materials, layout, panelization, stencils, soldering profiles, testability and process repeatability, identifying possible optimizations before series production. This approach reduces production criticalities, improves PCBA quality and makes the project more stable, controllable and scalable over time.

Do you have a complex electronic board to assemble?

SCEN can support you from prototype to industrialized production.

Talk to a specialist