Quality control, testing and 3D X-ray analysis

AOI/SPI 3D in-line controls, functional tests, ICT/Flying Probe and programming, with an internal nanofocus 3D X-ray analysis laboratory.

Quality is at the heart of SCEN’s mission. For this reason, the Smart Factory is equipped with a specialized department for testing the performance of all products coming from the assembly lines. Automated controls and innovative 3D inspection and X-ray technologies make it possible to validate the operation of even the most complex prototypes. In SCEN’s Smart Factory, every assembled product undergoes accurate functional testing, with sample testing for large series and vertical testing for prototypes, simulating real operating conditions to ensure optimal performance even in complex contexts.

In SCEN’s quality control process, Automated Optical Inspection, AOI 3D, and Solder Paste Inspection, SPI 3D, are key stages. SPI ensures uniform solder paste application, which is essential for solder joint stability and durability. 3D automated optical inspection analyzes component positioning, orientation and integrity from the earliest stages, detecting possible defects in time for immediate correction.

One of SCEN’s distinctive technologies is 3D X-ray analysis with nanofocus technology, performed in an internal laboratory specialized in the inspection of PCBAs, modules and complex electronic products. The system makes it possible to analyze non-visible solder joints, hidden components and packages such as BGA, uBGA and QFN, detecting defects that are difficult to identify with standard optical tools. The experience of SCEN technicians is essential to interpret images, recognize minimal anomalies and connect them to possible process, failure or industrialization causes.

What it can detect

Physical analysis and failure analysis on PCBAs and electronic modules

  • Assembly defects on SMD, BGA, uBGA and QFN components
  • Missing, shifting, tombstoning and incorrectly positioned components
  • Micro-balls, short circuits and non-compliant solder connections
  • Cold joints, dry joints, head-in-pillow and under-package defects not optically inspectable
  • Void analysis and irregularities in ball shape or size
  • Broken or damaged wire bonding
  • Cracks, fractures and anomalies in SMD and PTH joints
  • Verification of filling level in plated through-holes

Technical note

The feasibility of each inspection depends on the module configuration, PCBA layout and accessibility of the areas to be analyzed. However, SCEN’s experience in manufacturing miniaturized boards makes it possible, in most cases, to identify the origin of the defect and possible corrective or industrialization actions.

Technology in use

Nanofocus 3D X-ray system

  • Machine: Nikon XT V 160
  • Source: 160 kV open tube
  • Tube power: 20 W
  • 3D system: 5-axis manipulator
  • Tilt angle: from 0° to 72°
  • Resolution: up to 0.5 μm
  • Sample size: up to 711 × 762 mm
  • Laboratory: Highly Qualified Laboratory for PCBA X-RAY 3D solder joint analysis — LR47/1978 VII Art. 22 Co. 2

We have a dedicated testing area capable of creating customized fixtures, also directly connected to your designers’ platforms, to perform functional testing and programming of your boards. This allows us to meet different requirements while ensuring the highest level of safety and product coverage.

For climatic tests up to 300°C, we use the latest technologies to simulate the most extreme operating conditions, accelerating aging in order to ensure that products meet the highest standards of resistance and quality. Through convection drying and sterilization ovens, Burn-In helps us identify potential defects and infant mortality issues in components and boards in a timely manner.

SCEN’s quality control also includes advanced electrical tests such as In-Circuit Test, ICT, and Flying Probe. These tests verify continuity and the correct operation of each circuit connection, ensuring that every component functions as expected. Flying Probe is particularly useful for prototypes and small batches, as it allows flexible inspection without the need for dedicated fixtures.

In brief

  • 1 micro-laser PCB and PCBA repair line
  • Optical inspection
  • X-ray inspection
  • Electrical testing
  • Application of IPC standards to all processes

Equipment and technologies

  • 3 Automated Optical Inspection, AOI, machines
  • 1 3D SPI, Solder Paste Inspection, machine
  • 1 3D X-ray machine with nanofocus technology
  • 1 X-ray fluorescence machine
  • 1 PCB & PCBA micro-laser machine for surface treatment, track cutting and depaneling
  • 2 air and vapor reworking stations

Do you need to validate performance, solder joints or hidden defects?

Discover the controls and analyses available in the SCEN Smart Factory.

Request an analysis